NEPCON ASIA 2024,NEPCON ASIA

Venue Shenzhen World Exhibition & Convention Center (Baoan)

A New Era of Electronic Manufacturing in Sight at NEPCON ASIA 2024 Grand Opening!

Driven by factors of technological innovation, policy support, market demand, industrial chain integration, international market expansion, and green manufacturing, China has seen significant growth in key product areas of integrated circuits, smartphones, computers, and high-tech products. The electronics manufacturing industry is poised to embrace new development opportunities and growth cycles. NEPCON ASIA, in response to these industry trends, will be held at the Shenzhen World Exhibition & Convention Center (Bao’an) from November 6 to 8, 2024. The exhibition will showcase cutting-edge technologies and advanced electronic manufacturing solutions across three major sectors: circuit board assembly, semiconductor packaging & testing, and smart factory & automation. It will provide exhibitors with a comprehensive platform for new technology and product displays, resource-sharing, and business cooperation.

Based in Shenzhen, spanning Asia and expanding globally, NEPCON ASIA will collaborate with even more overseas institutions, such as consulates and industry associations this year. The event is expected to attract over 2,000 overseas purchasing delegations, helping exhibitors to further accelerate their expansion into the international markets, enhance their global competitiveness, and achieve sustained business growth and long-term brand development.

Global Leading SMT Companies to Appear at NEPCON ASIA

As one of Asia's largest SMT display platforms, NEPCON ASIA will gather hundreds of leading companies from around the world, including YAMAHA, HANWHA, FUJI, OMRON, KOH YOUNG, ERSA, PEMTRON, VERMES, Nordson, Pillarhouse, GKG, Desen, JT Electronics, Suneast, Anda, JUTZE, Aleader, AXXON, QUICK, HIKRANIN and more. The exhibition will focus on innovative equipment, materials, and solutions in SMT surface mounting, testing and measurement, welding, dispensing and spraying, electronic manufacturing services, electronic manufacturing automation, printed circuit boards, and electronic materials. The event will also feature exciting and interactive activities such as the SMTA South China Technology and Equipment Conference, innovation skill competitions in popular application industries, and discussions on the industry's most cutting-edge technology trends and latest market dynamics. These activities will bring together experts, scholars, and industry elites to share innovative products and help exhibitors grasp the latest technologies and information in the electronics manufacturing industry.

IC Packaging Fair Focuses on New Opportunities and Leads a New Era of Packaging and Testing

With growing demand in the domestic power semiconductor market, and the global market penetration rate of new energy passenger vehicles expected to reach 50% by 2030, the silicon carbide device market is set for explosive growth. Concurrently, the semiconductor packaging and testing market faces opportunities and challenges due to continuous upgrades and iterations of materials and equipment. The need for market expansion and industry chain upgrades has become imminent.

IC Packaging Fair 2024, referred to as ICPF, aims to lead industry trends and promote innovation. The organizer will focus on the IGBT & SiC Manufacturing demonstration line, creating the first power semiconductor packaging and testing manufacturing demonstration area at ICPF. The exhibition will cover the entire production line chain from materials, design, and process to equipment, showcasing the latest technologies, products, and solutions in the industry. It is expected to attract over 60 power semiconductor packaging and testing factories and more than 3,000 professional visitors for on-site exchanges and learning.

The complementary ICPF Forum elevates this technology and innovation event to new heights by bringing together top industry authorities and experts to discuss the latest technologies and developments in Advanced Wafer Fabrication, SIP & Advanced Packaging, and Compound Semiconductor Packaging. These discussions will reveal the industry's latest development trends and prospects, exploring high-growth industry applications and bringing unlimited business opportunities and inspiration to its participants.

From PCBA (printed circuit board assembly) and semiconductor packaging and testing to back-end automatic assembly, the degree of automation continues to expand in the electronic manufacturing industry. The widespread application of smart factories and automation technology has become a crucial driving force for a wide array of industries. With an aim to accelerate the intelligent upgrading and transformation of the manufacturing industry, the Chinese government has introduced policies such as "old for new" and "new quality productivity." It is expected that by 2028, the market size of China's smart factory industry will rapidly grow to 1.855 billion yuan. Smart factories and automation are entering an unprecedented period of rapid development.

Seizing the golden opportunity for intelligent upgrading and transformation of the global electronics manufacturing industry, the Smart Factory & Automation Technology Expo (S-Factory) will create a diversified and efficient business platform, featuring a combination of lighthouse factory visit, exhibitions and high-end conferences. By leveraging its rich business resources, S-Factory will work closely with leading companies in intelligent manufacturing and digitalization to conduct a series of lighthouse factory visit, providing the industry with an opportunity for in-depth learning, while promoting more enterprises to pursue intelligent and automated factory development. NEPCON ASIA will also launch the Exclusive Luncheon for Executives, creating a zero-distance communication platform for industry elites and core decisionmakers, and opening up unlimited business development possibilities.

Additionally, S-Factory will host a series of forums on smart factories and automation, focusing on technologies and solutions, such as warehousing, information management, high-growth industry applications, industrial robots, Internet of Things, and automation management. These forums will provide companies with insights into the latest intelligence and automation trends in the industry, helping them explore solutions for upgrades and transformations. This initiative will better promote cost reduction and efficiency gains for over 1,600 manufacturers of electronic products, semiconductor packaging and testing, automobile manufacturing, display product manufacturing, and new material manufacturing across eight concurrent exhibitions. It aims to achieve mutual benefit and win-win results, injecting new vitality and business opportunities into the manufacturing industry's future.

Domestic market demand is recovering, and overseas markets are also rising with the restructuring of the global supply chain. Favorable business environments and policy support have driven major EMS manufacturers in mobile phone manufacturing, lithium battery manufacturing, and semiconductor manufacturing to establish factories in popular destinations, such as Vietnam, Malaysia, Thailand, and Mexico. NEPCON ASIA 2024 has captured this trend with a special overseas supply-demand matchmaking meeting that will feature over 2,000 overseas procurement delegations. This initiative aims to help exhibitors establish connections with overseas markets, meet customers face-to-face, and achieve win-win cooperation in domestic and overseas markets.

NEPCON ASIA collaborates with overseas associations, consulates, chambers of commerce, investment bureaus, and other authoritative organizations to further bridge the information gap and trade barriers, in addition to helping exhibitors understand overseas market policies and buyer needs. A series of Country Day program and technical seminars (with Chinese and English interpretation) will deepen understanding of domestic and overseas markets and policies, transforming overseas business opportunities into real business. This effort will truly promote the latest PCBA technology, equipment, and quality Chinese products on the international stage.

NEPCON ASIA 2024 will be held concurrently with RX’s four major industry flagship exhibitions in automobiles, electronics, display screens, and new materials, creating a 160,000-square-meter super mega show. Hundreds of leading domestic and international companies will gather at the exhibitions, expecting to attract 150,000 professional visitors and offer unlimited business opportunities. Don’t miss out!

Booth booking is now open! Register now to participate in the exhibition, grasp the pulse of the market, and seize unlimited business opportunities at NEPCON ASIA 2024!

Fastener World's booth no. is to be determined.

NEPCON ASIA

NEPCON ASIA

NEPCON ASIA Date 2024-11-06~2024-11-08

Venue Shenzhen World Exhibition & Convention Center (Baoan)